参数资料
型号: ADMP421BCEZ-RL7
厂商: Analog Devices Inc
文件页数: 15/16页
文件大小: 0K
描述: MIC MEMS OMNI-DIR DGTL 5LGA
标准包装: 1
系列: ADMP421
类型: MEMS(硅)
输出类型: 数字,PDM
方向: 全向
频率范围: 100Hz ~ 15kHz
灵敏度: -26dB ±3dB
信噪比: 61dB
电压 - 额定: 1.8 ~ 3.3V
电流 - 电源: 650µA
端口位置: 底部
密封等级:
端子: 表面贴装型
尺寸/尺寸: 4.00mm L x 3.00mm W
高度(最大): 1.10mm
形状: 矩形
包装: 标准包装
其它名称: ADMP421BCEZ-RL7DKR
ADMP421
Data Sheet
Rev. D | Page 8 of 16
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP421 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 8. Care should be taken to avoid
applying solder paste to the sound hole in the PCB. A suggested
solder paste stencil pattern layout is shown in Figure 9. The
diameter of the sound hole in the PCB should be larger than the
diameter of the sound port of the microphone. A minimum
diameter of 0.5 mm is recommended.
4× 0.40 × 0.60
(0.30)
0.90
(0.30)
1.70
3.80
(0.30)
(1.000)
(0.550)
0.35
2.80
2× R0.10
(0.30)
0.35
2.05
0.70
1.10
075
96-
0
08
CENTER LINE
Figure 8. Suggested PCB Land Pattern Layout
1.45
0.9
2.45
0.7
1.525
1.000
0.35
1.849
1.498
0.205 WIDE
0.248 × 0.498 (2×)
0.248 × 1.148 (2×)
0.248 × 0.948 (2×)
1.498 × 0.248
0.398 × 0.298 (4×)
0.362 CUT (3×)
1.17
24°
075
96
-00
9
0.375
CENTER
LINE
Figure 9. Suggested Solder Paste Stencil Pattern Layout
OBSOLETE
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