参数资料
型号: ADMP401ACEZ-RL7
厂商: Analog Devices Inc
文件页数: 9/12页
文件大小: 0K
描述: MIC MEMS OMNI-DIR ANALOG 6-LGA
产品变化通告: ADMP401 Mount Change 16/Dec/2011
标准包装: 1
系列: ADMP401-1
类型: MEMS(硅)
输出类型: 模拟
方向: 全向
频率范围: 100Hz ~ 15kHz
灵敏度: -42dB ±3dB
信噪比: 62dB
阻抗: 200 欧姆
电压 - 额定: 1.5 ~ 3.3V
电流 - 电源: 250µA
端口位置: 底部
密封等级:
端子: 表面贴装型
尺寸/尺寸: 4.72mm L x 3.76mm W
高度(最大): 1.10mm
形状: 矩形
包装: 标准包装
产品目录页面: 2826 (CN2011-ZH PDF)
其它名称: ADMP401-1ACEZ-RL7DKR
ADMP401-1ACEZ-RL7DKR-ND
ADMP401-ACEZ-RL7DKR
ADMP401-ACEZ-RL7DKR-ND
ADMP401ACEZ-RL7DKR
ADMP401
Data Sheet
Rev. E | Page 6 of 12
PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP401 should
have a 1:1 ratio to the solder pads on the microphone package,
as shown in Figure 4. Take care to avoid applying solder paste to
the sound hole in the PCB.
A suggested solder paste stencil pattern layout is shown in
Figure 5. The diameter of the sound hole in the PCB should be
larger than the diameter of the sound port of the microphone.
A minimum diameter of 0.5 mm is recommended.
2.62
1.10
1.68
0.70 (2×)
0.90 (3×)
2.40
1.20
2.54
0.79
1.27
07712-
004
Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm)
1.27mm
1.2mm
2.54mm
2.62mm
3.41mm
2.4mm
0.85mm DIA. (3×)
1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)
0.649mm DIA. (2×)
07712-
005
Figure 5. Suggested Solder Paste Stencil Pattern Layout
OBSOLETE
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