参数资料
| 型号： | AD629ARZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC AMP DIFF 25MA LDRIFT 8SOIC |
| 设计资源： | Measuring -48 V High-Side Current Using AD629, AD8603, AD780, and AD7453 (CN0100) |
| 标准包装： | 2,500 |
| 放大器类型： | 差分 |
| 电路数： | 1 |
| 转换速率： | 2.1 V/µs |
| -3db带宽： | 500kHz |
| 电压 - 输入偏移： | 200µV |
| 电流 - 电源： | 900µA |
| 电流 - 输出 / 通道： | 25mA |
| 电压 - 电源，单路/双路(±)： | 5 V ~ 36 V，±2.5 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
AD629
Rev. C | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage, VS
±18 V
Internal Power Dissipation1
8-Lead PDIP (N)
See Figure 4
8-Lead SOIC (R)
See Figure 4
Input Voltage Range, Continuous
±300 V
Common-Mode and Differential, 10 sec
±500 V
Output Short-Circuit Duration
Indefinite
Pin 1 and Pin 5
–VS 0.3 V to +VS + 0.3 V
Maximum Junction Temperature
150°C
Operating Temperature Range
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Lead Temperature (Soldering 60 sec)
300°C
1 Specification is for device in free air:
8-Lead PDIP, θJA = 100°C/W;
8-Lead SOIC, θJA = 155°C/W.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
E
R
D
ISSI
P
A
TION
(
W
)
2.0
1.5
1.0
0.5
0
–50 –40 –30 –20 –10 0
10 20 30 40 50 60 70 80 90
00
78
3-
0
04
8-LEAD SOIC
TJ = 150°C
8-LEAD PDIP
Figure 4. Maximum Power Dissipation vs. Temperature for SOIC and PDIP
DIE SIZE: 1655m (X) by 2465m (Y)
X
Y
7
2
1a
1b
3
4
5a
5b
6b
6a
0
078
3-
0
41
Figure 5. Metallization Photograph
Table 3. Pin Pad Coordinates
Coordinates1
Pad
Pin
X
Y
Description
1a
REF()
677
+1082
1b
534
+1084
For the die model, either
pad can be bonded because
1a and 1b are internally
shorted.
2
IN
661
+939
3
+IN
661
658
4
VS
+680
800
5a
REF(+)
+396
1084
5b
+538
1084
For the die model, either
pad can be bonded because
5a and 5b are internally
shorted.
6a
OUTPUT
+681
950
6b
+681
807
For the die model, both
pads must be bonded
because 6a and 6b are not
internally shorted.
7
+VS
+680
+612
1 All coordinates are with respect to the center of the die.
ESD CAUTION
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