参数资料
型号: AD5173BRM10
厂商: Analog Devices Inc
文件页数: 22/28页
文件大小: 0K
描述: IC DGTL POT DUAL 10K OTP 10-MSOP
标准包装: 50
接片: 256
电阻(欧姆): 10k
电路数: 2
温度系数: 标准值 35 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 管件
Data Sheet
AD5172/AD5173
Rev. I | Page 3 of 28
REVISION HISTORY
8/13—Rev. H to Rev. I
Changed VA, VB, VW to GND and Digital Inputs and Output
Voltage to GND Rating to 0.3 V to +7 V or VDD + 0.3 V
(whichever is less); Table 4...............................................................7
Changes to Ordering Guide...........................................................25
4/09—Rev. G to Rev. H
Changes to DC Characteristics—Rheostat Mode Parameter and
to DC Characteristics—Potentiometer Divider Mode Parameter,
Table 1.................................................................................................3
12/08—Rev. F to Rev. G
Changes to OTP Supply Voltage Parameter, Table 1 ....................3
Changes to OTP Supply Voltage Parameter, Table 2 ....................5
Changes to Table 5 and Table 6 .......................................................8
Changes to One-Time Programming (OTP) Section ................15
Changes to Power Supply Considerations Section, Figure 46,
and Figure 46 Caption ....................................................................17
Changes to Ordering Guide...........................................................23
7/08—Rev. E to Rev. F
Changes to Power Supplies Parameter in Table 1 and Table 2 ....3
Updated Fuse Blow Condition to 400 ms Throughout................5
1/08—Rev. D to Rev. E
Changes to Features ..........................................................................1
Changes to General Description .....................................................1
Changes to OTP Supply Voltage and OTP Supply Current in
Table 1.................................................................................................3
Changes to OTP Supply Voltage and OTP Supply Current in
Table 2.................................................................................................5
Added OTP Program Time in Table 3............................................6
Changes to Table 4 ............................................................................7
Changes to Table 5 and Table 6 .......................................................8
Inserted Figure 30............................................................................13
Replaced One-Time Programming (OTP) Section....................15
Replaced Power Supply Considerations Section.........................17
Deleted Device Programming Software Section.........................20
Replaced I2C-Compatible, 2-Wire Serial Bus Section................21
Changes to Ordering Guide...........................................................23
6/06—Rev. C to Rev. D
Changes to Features ..........................................................................1
Changes to One-Time Programming (OTP) Section ................15
Changes to Figure 44 and Figure 45 .............................................17
Changes to Power Supply Considerations Section .....................18
Changes to Figure 46 and Figure 47 .............................................18
Changes to Device Programming Software Section...................19
Updated Outline Dimensions........................................................24
6/05—Rev. B to Rev. C
Added Footnote 8, Footnote 9, and Footnote 10 to Table 1........3
Added Footnote 8 to Table 2............................................................5
Changes to Table 5 and Table 6 .......................................................9
Changes to Power Supply Considerations Section .....................17
Changes to I2C-Compatible 2-Wire Serial Bus Section .............23
Added Level Shifting for Different Voltage Operation Section.......24
Updated Outline Dimensions........................................................25
Changes to Ordering Guide...........................................................25
10/04—Rev. A to Rev. B
Updated Format ................................................................ Universal
Changes to Specifications.................................................................3
Changes to One-Time Programming (OTP) Section ................13
Changes to Power Supply Considerations Section .....................15
Changes to Figure 44 and Figure 45 .............................................15
Changes to Figure 46 and Figure 47 .............................................16
11/03—Rev. 0 to Rev. A
Changes to Electrical Characteristics—2.5 k .............................3
11/03—Revision 0: Initial Version
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AD5173BRM100 功能描述:IC DGTL POT DUAL 100K OTP 10MSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
AD5173BRM100-RL7 功能描述:IC DGTL POT DUAL 100K OTP 10MSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
AD5173BRM10-RL7 功能描述:IC DGTL POT DUAL 10K OTP 10-MSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
AD5173BRM2.5 功能描述:IC DGTL POT DUAL 2.5K OTP 10MSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
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