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参数资料
型号： A1425A-STDCQ132C
元件分类： FPGA
英文描述： FPGA, 310 CLBS, 7500 GATES, CQFP132
封装： CERAMIC, QFP-132
文件页数： 4/54页
文件大小： 343K
代理商： A1425A-STDCQ132C
RadTolerant FPGAs
1- 8
v3.1
Package Thermal Characteristics
The device junction to case thermal characteristic is
θ
jc,
and the junction to ambient air characteristic is
θ
ja. The
thermal characteristics for
θ
ja are shown with two
different air flow rates.
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a CQFP 172-pin package at
military temperature is as follows:
EQ 1-2
Power Dissipation
General Power Equation
P = [ICCstandby + ICCactive] * VCC + IOL * VOL * N +
IOH * (VCC – VOH) * M
EQ 1-3
where:
ICCstandby is the current flowing when no inputs
or outputs are changing.
ICCactive is the current flowing due to CMOS
switching.
IOL, IOH are TTL sink/source currents.
VOL, VOH are TTL level output voltages.
N equals the number of outputs driving TTL loads
to VOL.
M equals the number of outputs driving TTL loads
to VOH.
Accurate values for N and M are difficult to determine
because they depend on the family type, on design
details, and on the system I/O. The power can be divided
into two components: static and active.
Static Power Component
Actel FPGAs have small static power components that
result in power dissipation lower than that of PALs or
PLDs. By integrating multiple PALs or PLDs into one
FPGA, an even greater reduction in board-level power
dissipation can be achieved.
The power due to standby current is typically a small
component of the overall power. Standby power is
calculated below for commercial, worst-case conditions.
The static power dissipated by TTL loads depends on the
number of outputs driving HIGH or LOW and on the DC
load current. Again, this value is typically small. For
instance, a 32-bit bus sinking 4 mA at 0.33 V will
generate 42 mW with all outputs driving LOW, and
140 mW with all outputs driving HIGH.
Table 1-6 Package Thermal Characteristics
Package Type
Pin Count
θ
jc
θ
ja
Still Air
θ
ja
300 ft./min.
Units
Ceramic Quad Flat Pack
8
7.8
40
30
°C/W
132
7.2
35
25
°C/W
172
6.8
25
20
°C/W
196
6.4
23
15
°C/W
256
6.2
20
10
°C/W
Max. junction temp. (°C) – Max. military temp.
θ
ja
°C/W
()
-----------------------------------------------------------------------------------------------------------------------
150°C – 125°C
25°C/W
---------------------------------------1.0W
==
ICC
VCC
Power
2 mA
5.25 V
10.5 mW
相关PDF资料
PDF描述
A1425A-STDCQ132M FPGA, 310 CLBS, 7500 GATES, 100 MHz, CQFP132
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A14100A-STDCQG256M FPGA, 1377 CLBS, 30000 GATES, 85 MHz, CQFP256
A1460A-1PQ160M FPGA, 848 CLBS, 6000 GATES, 125 MHz, PQFP160
A1460A-PQ160M FPGA, 848 CLBS, 6000 GATES, 100 MHz, PQFP160
相关代理商/技术参数
参数描述
A1425A-STDCQ132M 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
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A1425A-VQ100I 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55）
A1425A-VQG100C 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55）
A1425A-VQG100I 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55）
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