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参数资料
| 型号： | 97-56001 |
| 厂商： | ARIES ELECTRONICS INC |
| 元件分类： | 插座 |
| 英文描述： | QFP132-PGA132, IC SOCKET |
| 文件页数： | 1/1页 |
| 文件大小： | 432K |
| 代理商： | 97-56001 |
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Convert surface-mount QFP packages to a 13x13 PGA footprint.
Reduce costs by using less-expensive QFP packages to replace PGA footprints in
existing designs.
Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact.
Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
ADAPTOR BODY: FR-4 with 1-oz. Cu traces
PADS: finished with ENIG (Immersion Au over Electroless Ni) to eliminate copla-
narity concerns and solder bridges associated with hot air solder leveling
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: 200 [5.08] Sn/Pb 93/7 per ASTM B579-73 over 100 [2.54]
Ni per SAE AMS-QQ-N-290
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will Plug into standard PGA socket
18021
Rev. AB
P/N 97-56001 Motorola DSP56000/001
QFP-to-PGA Adapter
ORDERING INFORMATION
P/N 97-56001 QFP-to-PGA 13x13 Adapter
P/N 97-56001-P QFP-to-PGA 13x13
Panelized Form
P/N 100-PGM13069-30 QFP-to-PGA 13x13
Wire Wrap
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE: Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
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