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| 型号： | 85411AMILFT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 85411 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO8 |
| 封装： | 3.90 X 4.90 MM, 1.37 MM HEIGHT, ROHS COMPLIANT, SOIC-8 |
| 文件页数： | 3/15页 |
| 文件大小： | 287K |
| 代理商： | 85411AMILFT |
IDT / ICS DIFFERENTIAL-TO-LVDS FANOUT BUFFER
11
ICS85411AMI REV. B JANUARY 20, 2009
ICS85411I
LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVDS FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85411I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85411I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 10% = 3.63V, which gives worst case results.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.63V * 50mA = 181.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 5 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.182W * 103.3°C/W = 103.8°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (multi-layer).
TABLE 5. THERMAL RESISTANCE
θθθθθ
JA
FOR
8-LEAD SOIC, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
128.5°C/W
115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
112.7°C/W
103.3°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 85411AMLF | 功能描述:时钟缓冲器 Low Skew 1-to-2 Diff to LVDS Fanout Buff RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| 85411AMLFT | 功能描述:时钟缓冲器 Low Skew 1-to-2 Diff to LVDS Fanout Buff RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| 8541210075 | 制造商:ON Semiconductor 功能描述:NPN Transistor,45V,0.8A,TO-92 |
| 854125-1 | 功能描述:集管和线壳 ACTUATOR, VALVE RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 854126-1 | 制造商:TE Connectivity 功能描述:BLOCK, DRIVE - Bulk |
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