参数资料
| 型号： | 70ABJ-2-M0E |
| 厂商： | Bourns Inc. |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | MODULAR CONTACT SMD MALE |
| 标准包装： | 500 |
| 系列： | 70AB |
| 连接器类型： | 压缩触点，公型 |
| 触点数： | 2 |
| 间距： | 0.050"（1.27mm） |
| 行数： | 1 |
| 安装类型： | 表面贴装 |
| 材质： | 铜合金 |
| 包装： | 带卷 (TR) |
Features
■ 1.27 mm pitch
■ Precious metal contacts
■ Twin hot contacts (symmetrical pad layout)
contacts
■ Pick & place compatible
■ High cycle life
70AB/Male - Modular Contact
Materials & Finishes
Product Dimensions
Recommended PWB Layout
Insulator .... Glass reinforced thermoplastic,
UL 94V-0 rated, black
Contact ...................................Copper alloy
70ABJ
A
TYP.
NON-ACCUM.
1.27
B
Finish
(.050)
Underplating....................... 30 μ ” min. Ni
Contact Area ......... 30 μ ” min. Au over Ni
Operating Characteristics
Electrical
5.00
(.197)
TYP.
0.71
(.028)
Current Rating....................... 3 A/contact
Voltage Rating..................................60 V
Contact Resistance .... 25 milliohms max.
Dielectric Voltage .....................AC 500 V
Insulating Resistance .. 1000 Mohms min.
0.41
(.016)
5.59
(.220)
Operating Temperature
......................................-55 °C to +125 °C
Mechanical
Normal Force/Finger ........ 40 grams min.
Durability ..................... 5,000 cycles min.
1.27
(.050)
Number of
TYP.
Dimension
How to Order
70AB J - 4 - M 0 E
1.27
(.050)
CONTACT SPACING
1.12
(.044)
Contacts
2
B
1.98
(.078)
Model
Terminal Style
3
3.25
(.128)
Number of Contacts (N)
2, 3 or 4
Gender
M = Male
Options
0 = Standard
0.13
(.005)
2.08
(.082)
TOLERANCES:
4
±0.25
(±.010)
4.52
(.178)
UNLESS OTHERWISE NOTED
Packaging Option
E = Embossed Tape (500 pcs. per reel -
MSL-1)
0.46
(.018)
Number of
Contacts
2
3
4
Dimension
A
3.12
(.123)
4.39
(.173)
5.66
(.223)
3.44
(.135)
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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