参数资料
| 型号： | 580200W00000G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 18/116页 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 产品培训模块： | How to Select a Heat Sink |
| 标准包装： | 2,000 |
| 类型： | 顶部安装 |
| 冷却式包装： | 14-DIP 和 16-DIP |
| 固定方法： | 压接式和 PC 引脚 |
| 形状： | 矩形 |
| 长度： | 0.890"（22.61mm） |
| 宽： | 0.600"（15.24mm） |
| 机座外的高度（散热片高度）： | 0.410"（10.42mm） |
| 温升时的功耗： | 1W @ 20°C |
| 在强制气流下的热敏电阻： | 在 200 LFM 时为12.0°C/W |
| 自然环境下的热电阻： | 20°C/W |
| 材质： | 铝 |
| 材料表面处理： | 黑色阳极化处理 |
| 其它名称： | 002674 |
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A
C
CESSORIES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Grease & Epoxy
Ther-O-Bond
TM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-Bond
TM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
Ther-O-Bond
TM Adhesive
Mix ratio by weight,
100 to 15
resin to hardener:
Mixed viscosity @ 25°C, cps:
1000 - 1500
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
For smaller applications, Ther-O-Bond
TM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards. This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bond
TM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
Mix ratio by weight,
100 to 5
resin to hardener:
Mixed viscosity @ 25°C, cps:
33,000
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
HANDLING CHARACTERISTICS
Color
Blue
Specific gravity:
2.30
Operating temp, °C
-70 to 115
Hardness, shore D:
90
Izod impact, F1 Lbs/Inch of notch
0.49
Thermal
0.85
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Tensile lap shear, psi
2900
Dielectric strength (volts/mil)
410
Dielectric constant (1 KHz @ 25°C)
5.9
Dissipation factor, KH@ 25°C
5.9
Shelf life
18 months*
Ther-O-Bond
TM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
Color
White
Thermal
0.48
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
2360 psi
Dielectric strength (volts/mil)
220
Shelf life
18 months*
Part number
Description
Package/Kit
Size
159900F00000G
Ther-O-BondTM 1500
Resin and hardener
0.946 liter (1 qt)
161000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
10gm (0.35 oz)
164000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
40gm (1.40 oz)
200000F00000G
Ther-O-BondTM 2000
Adhesive syringe
25ml
Activator bottle
13ml
ORDERING INFORMATION
PRODUCT INFORMATION
Ther-O-Bond
TM 1500
Ther-O-Bond
TM 1600
Ther-O-Bond
TM 2000
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Color
Black
Specific gravity
1.5
Operating temp, °C
-60 to 155
Heat distortion temp, °C
100
Hardness, shore D:
88
Thermal
1.26
conductivity W/(m°C)
Compressive strength, psi
14,000
Dissipation factor,
0.01
Self extinguishing:
yes
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Dielectric
800
Shelf life
18 months*
PHYSICAL PROPERTIES
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
相关PDF资料 |
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|---|---|
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| 591302B04000G | BOARD LEVEL HEAT SINK |
| 5915PC-22T-B30-SM0 | FAN 220VAC 172X150X38MM POTTED |
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| 5802-1 | 制造商:Carlisle Interconnect Components 功能描述:RF COAXIAL PANEL MOUNT CONNECTOR |
| 580-213B | 制造商:LG Corporation 功能描述:GS200 OPERATIONS MANUAL |
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