参数资料
| 型号： | 4953G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 2/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全数据表： | 4953A THERMALBOND MSDS 4953B THERMALBONDMSDS |
| 标准包装： | 1 |
| 系列： | Thermalbond™ |
| 类型： | 环氧树脂硬化剂 |
| 尺寸/尺寸： | 4 磅包装 |
| 其它名称： | 033871 |
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10
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD = 12 watts
RθJC = 2.5°C/W (from semiconductor manufacturer)
TJ max = 140°C (from semiconductor manufacturer)
TA max = 50°C
A Hi-Flow pad works great with clip mounting and provides the
necessary electrical insulation. Thermal resistance for
Hi-Flow at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for RθSA
RθSA = 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W. This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0” tall
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Given:
PD = 6 watts
RθJC = 3°C/W (from semiconductor manufacturer)
TJ max = 150°C (from semiconductor manufacturer)
TA max = 65°C
A KonduxTM pad is a good choice for electrically conductive
applications. Thermal resistance for KonduxTM can be determined
from the following graph.
Example B
Example A
Typical TO-220 Performance
Screw Torque (in-lb)
0.00
012
3
4
5
R
(C/W
)
CS
0.10
0.20
0.30
0.40
0.50
0.60
6
How To Select a Heat Sink
At 2 in-lb of torque the thermal resistance
is approximately RθCS = 0.5°C/W
Using equation 1, solve for RθSA
RθSA = 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
RθSA = 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
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rom
MT
G
Sur
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et
oAmbien
t—°C/W
at
t
10
0
20
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60
80
100
0
2
4
6
8
10
8
6
2
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0
400
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1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53330X
53320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Hi-Flow is a trademark of the Bergquist Company
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PDF描述 |
|---|---|
| 5-1542000-6 | HEAT SINK BGA 25MM 2FIN RADIAL |
| 5-1542003-0 | 25MM HS ASSY ULTEM CL |
| 5-1542003-1 | 25MM HS ASSY ULTEM CL |
| 5-1542003-9 | 27MM LOW P HS ASSY A- |
| 5-1542004-4 | HEAT SINK BGA 21MM 3FIN RADIAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 4954 | 功能描述:测试点 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安装孔: 电路板厚度: 颜色: |
| 4-954293-1 | 制造商:TE Connectivity 功能描述: |
| 49544-0892 | 制造商:MOLEX 功能描述: |
| 49545-0892 | 功能描述:集管和线壳 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 49-54-5615 | 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT |
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