参数资料
型号: 4951G
厂商: Aavid Thermalloy
文件页数: 36/116页
文件大小: 0K
描述: THERMAL EPOXY
MSDS 材料安全数据表: 4951A THERMALBOND MSDS
4951B THERMALBOND MSDS
标准包装: 1
系列: Thermalbond™
类型: 环氧树脂硬化剂
尺寸/尺寸: 3.5 盎司包装
其它名称: 033869
26
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
FIGURE A
SMT Footprints
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
7.62
(0.300)
15.49
(0.610)
1.40
(0.060)
0.80
(0.030)
W
L
1
2
FIGURE B
FIGURE D
FIGURE C
L
W
16.76
(0.660)
2.54
(0.100)
10.67
(0.420)
20.32
(0.800)
2.54
(0.100)
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
Part Number
“L”
“W”
573100
9.53 (0.375)
13.97 (0.550)
573300
14.22 (0.560)
16.26 (0.640)
573400
14.22 (0.560)
21.08 (0.830)
Part Number
“L”
“W1”
“W2”
573100
9.02 (0.355)
13.46 (0.530)
8.89 (0.350)
573300
13.72 (0.540)
15.75 (0.620)
11.18 (0.440)
573400
13.72 (0.540)
20.57 (0.810)
16.00 (0.630)
Recommended copper pad size
for heat sink and device mounting footprint
For D Pak (TO-263)
For MO-184 and SO-10
Recommended copper pad size
for heat sink and device mounting footprint
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