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参数资料
| 型号： | 450-0004 |
| 厂商： | LS Research LLC |
| 文件页数： | 25/45页 |
| 文件大小： | 0K |
| 描述： | KIT DEV PROFLEX01-R2 F ANTENNA |
| 标准包装： | 1 |
| 系列： | Pro-Flex01 |
| 类型： | 收发器，ISM |
| 频率： | 2.4GHz |
| 适用于相关产品： | ProFlex01 |
| 已供物品： | 板 |
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ProFLEX01-R2 TRANSCEIVER MODULE
DATASHEET
CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the ProFLEX01-R2 modules are
delivered in trays of 25.
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Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
Handling
The ProFLEX01-R2 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
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Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
330-0098-R2.0
Copyright ? 2012 LS Research, LLC
Page 25 of 45
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相关代理商/技术参数 |
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|---|---|
| 45000-0452 | 制造商:MOLEX 功能描述:18 ASSEMBLY |
| 45000-0463 | 制造商:MOLEX 功能描述:Discrete ass. 18awg |
| 45000-0464 | 制造商:MOLEX 功能描述:DISCRETE ASSEMBLY |
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| 450-0005 | 功能描述:PROFLEX01-R2 U.FL CONNECTOR, DEV 制造商:laird - wireless & thermal systems 系列:* 零件状态:在售 标准包装:1 |
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