参数资料
型号: 4312-DK1
厂商: Silicon Laboratories Inc
文件页数: 19/22页
文件大小: 0K
描述: KIT DEV OOK RECEIVER SI4312
视频文件: Wireless MCU in a Metering M-Bus Application
特色产品: Si4010 EZRadio? Wireless IC
标准包装: 1
系列: EZRadio®
类型: 接收器,OOK
频率: 315MHz,434MHz
适用于相关产品: Si4312
已供物品:
产品目录页面: 585 (CN2011-ZH PDF)
其它名称: 336-1983
Si4312
Table 14. PCB Land Pattern Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Max
Min
Max
D
2.71 REF
GE
2.10
D2
1.60
1.80
W
0.34
e
E
0.50 BSC
2.71 REF
X
Y
0.28
0.61 REF
E2
1.60
1.80
ZE
3.31
f
GD
2.53 BSC
2.10
ZD
3.31
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a fabrication allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder-mask-defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 μm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component standoff.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for small body components.
Rev. 0.5
19
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