参数资料
| 型号： | 3764-M003 |
| 厂商： | 3M |
| 文件页数： | 6/32页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER STKD 64POS GOLD |
| 标准包装： | 100 |
| 系列： | 3000 |
| 触点类型：： | 公形引脚 |
| 连接器类型： | 接头，有罩，可堆叠（2） |
| 位置数： | 64，64 |
| 加载位置的数目： | 全部 |
| 行数： | 2 |
| 安装类型： | 通孔 |
| 包装： | 散装 |
| 配套产品： | 9164-4500PL-ND - CONN SOCKET 64POS .100" STR GOLD 3M9063-ND - CONN RECEPT IDC 64POS 28-26 AWG 3M9062-ND - CONN RECEPT IDC 64POS 24-22 AWG 3M9061-ND - CONN RECEPT IDC 64POS 28-26 AWG 3M9122-ND - CONN RECEPT IDC 64POS 24-22 AWG |
| 其它名称： | 05111153086 80400011088 |
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3M ? BOARDMOUNT CONNECTOR SOLUTIONS
PRODUCT
PIN STRIP HEADERS
SERIES 95X
BOARDMOUNT PIN STRIPS
AND SOCKETS
2 MM, SERIES 95X
BOX HEADERS
2 MM X 2 MM, SOLDER TAIL
SERIES 957
SOCKETS AND PIN STRIP
HEADERS, .100" X .100"
SERIES 929
POLARIZED BOARDMOUNT
SOCKETS, .100" X .100"
SERIES 5100, 6800, 8500, 9100
SOCKETS AND PIN STRIP
HEADERS, 2 MM X 2 MM
SERIES 15
6
FEATURES
? ROHS COMPLIANT
? Single and Dual Row
? 3 - 80 Positions
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? End Stackable Feature
? Mates with Boardmount and
Wiremount Products
? Available in Straight, Right Angle
Through-Hole and Surfacemount
Versions
? ROHS COMPLIANT
? Maximizes Use of PC Board Space
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Dual Row Design, 4–80 Pins
? Minimized PC Board
Stacking Heights
? Mates With Pin Strip Header
Products
? Available in Straight, Right Angle
Through-Hole, Through-Board and
Surfacemount Versions
? ROHS COMPLIANT
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? Center Slot Polarization
Prevents Mis-Insertions and
Reduces Insertion Time
? 10 - 68 Positions
? ROHS COMPLIANT VERSION AVAILABLE
? 2-72 Positions
? Single- and Dual-Row Options
? Through-Hole and Through-Board
Options
? Customizable Stack Heights
from .150" to 1.325"
? High Temperature Insulator Option
? ROHS COMPLIANT
? 10-64 Positions
? Vertical and Right Angle Options
? Center Bump Polarization
? ROHS COMPLIANT VERSION AVAILABLE
? 4-60 Positions
? Single and Dual-Row Options
? Surfacemount, Through-Hole
and Through-Board Options
? Customizable Stack Heights
from .101" to 1.418"
? High Temperature Insulator
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ’" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Square Pin 0.5 mm,
Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
(PBT) or PCT (RoHS Compliant)
FLAMMABILITY UL 94V-0
PLATING
Pin Strip Underplating: 50 μ"
[ 1.27 μm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Socket Underplating: 100 μ"
[ 2.54 mm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Tin Plated Versions Available
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
FLAMMABILITY UL 94V-0
PLATING
Underplating: 2 μm [ 79 μ" ] Nickel
Wiping Area: 0.3 μm [ 12 μ" ] Gold
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled PCT
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50-150 μ"
[ 1.27-3.81 μm ] Nickel
Wiping Area: 30 μ" [ 0.76 μm ] Gold
PERFORMANCE
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A, 2 A or 2.5 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
3M.com/interconnects
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 3764N | 制造商:Molex 功能描述: 制造商:Molex 功能描述:CONNECTOR 50A 3P4W 250DC/600AC REPLACEME |
| 3764PG | 功能描述:集管和线壳 SCTCH-WLD HOT MELT ADH 3764 PG, 22# CS RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 3764Q | 制造商:3M Electronic Products Division 功能描述: 制造商:3M Electronic Products Division 功能描述:Jet-melt Adhesive Q 5/8" dia x 8" lgth |
| 3764-Q | 功能描述:化学物质 SCTCH-WLD HTMLT ADH 3764 Q, 11# CASE RoHS:否 制造商:3M Electronic Specialty 产品:Adhesives 类型:Epoxy Compound 大小:1.7 oz 外壳:Plastic Tube |
| 3764Q-5/8-8 | 功能描述:3M 3764 SCOTCH-WELD HOT MELT ADH 制造商:3m (tc) 系列:- 零件状态:在售 类型:热熔性 特性:透明 配套使用产品/相关产品:多用途 发货信息:- 标准包装:1 |
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