参数资料
| 型号： | 320205B00000G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 106/116页 |
| 文件大小： | 0K |
| 描述： | HEATSINK TO-5 1W H=.25"BLK |
| 产品培训模块： | How to Select a Heat Sink |
| 标准包装： | 1,000 |
| 类型： | 插件板级 |
| 冷却式包装： | TO-5 |
| 固定方法： | 压接式 |
| 形状： | 圆柱 |
| 直径： | 0.305"（7.75mm）内径，0.500"（12.70mm）外径 |
| 机座外的高度（散热片高度）： | 0.250"（6.35mm） |
| 温升时的功耗： | 0.6W @ 40°C |
| 在强制气流下的热敏电阻： | 在 200 LFM 时为35°C/W |
| 自然环境下的热电阻： | 63°C/W |
| 材质： | 铝 |
| 材料表面处理： | 黑色阳极化处理 |
| 产品目录页面： | 2670 (CN2011-ZH PDF) |
| 其它名称： | 2257 320205B00000 HS253 |
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HO
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ELECT
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HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
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