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参数资料
| 型号： | 2SK3886-01MR |
| 厂商： | FUJI ELECTRIC CO LTD |
| 元件分类： | JFETs |
| 英文描述： | 67 A, 120 V, 0.03 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
| 封装： | TO-220F, 3 PIN |
| 文件页数： | 2/18页 |
| 文件大小： | 410K |
| 代理商： | 2SK3886-01MR |
DW
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NO
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H04-004-03
MS5F5814
10 / 18
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Before touching a MOSFET terminal, Discharge any static electricity from your body and clothes by ground-
ing out through a high impedance resistor (about 1M
)
When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron or
soldering bath through a low impedance resistor.
You must design the MOSFETs to be operated within the specified maximum ratings(voltage, current,
temperature, etc.) to prevent possible failure or destruction of devices.
Consider the possible temperature rise not only for the channel and case, but also for the outer leads.
Do not directly touch the leads or package of the MOSFETs while power is supplied or during operation in
order to avoid electric shock and burns.
The MOSFETs are made of incombustible material. However, if a MOSFET fails, it may emit smoke or
flame. Also, operating the MOSFETs near any flammable place or material may cause the MOSFETs to
emit smoke or flame in case the MOSFETs become even hotter during operation. Design the arrangement
to prevent the spread of fire.
The MOSFETs should not used in an environment in the presence of acid, organic matter, or corrosive
gas(hydrogen sulfide, sulfurous acid gas etc.)
The MOSFETs should not used in an irradiated environment since they are not radiation-proof.
Installation
Soldering involves temperatures which exceed the device storage temperature rating. To avoid device
damage and to ensure reliability, observe the following guidelines from the quality assurance standard.
Solder temperature and duration (through-hole package)
Solder temperature
Duration
260
5
C
10
1 seconds
350
10
C
3.5
0.5 seconds
The immersion depth of the lead should basically be up to the lead stopper and the distance should be a
maximum of 1.5mm from the device.
When flow-soldering, be careful to avoid immersing the package in the solder bath.
Refer to the following torque reference when mounting the device on a heat sink. Excess torque applied to
the mounting screw causes damage to the device and weak torque will increase the thermal resistance,
both of which conditions may destroy the device.
Table 1: Recommended tightening torques.
Package style
Screw
Tightening torques
Note
TO-220
TO-220F
M3
30
–50 Ncm
TO-3P
TO-3PF
TO-247
M3
40
–60 Ncm
TO-3PL
M3
60
–80 Ncm
flatness : < ±30
m
roughness : <10
m
Plane off the edges :
C<1.0mm
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相关代理商/技术参数 |
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|---|---|
| 2SK3891-01RSC | 制造商:Fuji Electric 功能描述: |
| 2SK3892 | 功能描述:MOSFET N-CH 200V 22A TO-220D RoHS:是 类别:分离式半导体产品 >> FET - 单 系列:- 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| 2SK3899-ZK-E1-A | 制造商:Renesas Electronics Corporation 功能描述: |
| 2SK389BL | 制造商:Toshiba America Electronic Components 功能描述: |
| 2SK3902-ZK-E1-AZ | 制造商:Renesas Electronics Corporation 功能描述:Cut Tape |
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