参数资料
型号: 2013620-1
厂商: Tyco Electronics
元件分类: 插座
英文描述: PGA Sockets
中文描述: PGA Sockets
文件页数: 1/2页
文件大小: 852K
代理商: 2013620-1
Introducing
Sockets for rPGA989 and rPGA988 Processors
TE connectivity surface mount rPGA sockets are designed for use with Intel’s
CoreTM i7 989 and 988 mobile processors. The socket is designed for notebook
motherboards that require a low profile surface mount interconnect. A simple
screw cam is used to secure the package in place. The sockets are validated to
Intel’s design guides for high performance and extreme mobile products.
相关PDF资料
PDF描述
2013620-2 PGA Sockets
2013620-3 PGA Sockets
201LS56 SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, PANEL MOUNT
2020-15T-A1FLF TELECOM, SURGE PROTECTION CIRCUIT, XSS3
2020-15T-A1F TELECOM, SURGE PROTECTION CIRCUIT, XSS3
相关代理商/技术参数
参数描述
2013620-2 功能描述:IC 与器件插座 rPGA989 35x36 SOCKET ZIF RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C
2013620-3 功能描述:IC 与器件插座 rPGA989 35x36 SOCKET ZIF RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C
2013620-4 功能描述:IC 与器件插座 SOCKET ASSY W/ EMBOSS ,RPGA989 RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C
2013622 制造商:IAC Industries Inc 功能描述:D4 S/S MOT-HYD ADJ HGT 36DX60L
2013623 制造商:IAC Industries Inc 功能描述:D4 S/S MOT-HYD ADJ HGT 36DX72L