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参数资料
| 型号： | 130-12 |
| 英文描述： | Analog IC |
| 中文描述： | 模拟IC |
| 文件页数： | 2/12页 |
| 文件大小： | 200K |
| 代理商： | 130-12 |
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
s
Asia/Pacific: Tel.
+85 2 2375 0618
s
Europe: Tel. +44 (1344) 869 595
Fax (800) 618-8883
Fax
+85 2 2375 0350
Fax +44 (1344) 300 020
10
Specifications Subject to Change Without Notice.
Soldering cont’d.
Post-Solder Cleaning
TEMP
°C
250
200
150
100
50
10 - 30 MIN
AT
80 - 130
°C
PREHEAT
30 - 180 SEC
AT 110 - 150
°C
AMBIENT
OR
FORCED
COOL DOWN
REFLOW
20 - 90 SEC
AT 215
°C
Figure 5
Typical Vapor Phase Heating/Soldering Profile
A 15-40 watt max. fine point tip soldering iron is recommended for
manual soldering. Soldering iron tip temperature should not exceed
350-370°C. Lengthy application of heat and/or direct contact of the
iron tip with the plastic housing should be avoided. The flux core solder
(i.e.; 63/37 RMA, 62/36/2 RMA) is recommended. The center
contact pad reflows easiest because of relatively low thermal mass,
therefore, the center contact lead should be soldered first to minimize
connector ”skating“.
OSMT plug receptacles can withstand most electronics grade
cleaning agents including: high temperature water/aqueous cleaners,
ethanol, methanol, MEK, acetone, 1,1,1-tricloroethane, trichlordethyl-
ene, perchloroethylene, chlorofloro-carbon (CFC) solvents,
isopropanol, dichlorofluoroethane, and blends. The OSMT cable jacket
can also withstand mild exposure to the above listed cleaning agents.
OSMT ApplicationNotes
Decimal inch equivalents are shown in parentheses for general information only.
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