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参数资料
| 型号： | 12062R823M8BB0G |
| 厂商： | YAGEO CORP |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 25 V, FEED THROUGH CAPACITOR |
| 封装： | EIA STD PACKAGE SIZE 1206 |
| 文件页数： | 4/14页 |
| 文件大小： | 291K |
| 代理商： | 12062R823M8BB0G |
2001 May 30 Rev.3
12
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
Class 2, X7R 16/25/50 V
feedthrough
TESTS AND REQUIREMENTS
Table 3
Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
no visible damage
4.5
visual inspection and
dimension check
any applicable method using
×10 magnification
in accordance with specification
4.6.1
capacitance
f = 1 kHz; measuring voltage
1Vrms at 20
°C
within specified tolerance
4.6.2
tan
δ
f = 1 kHz; measuring voltage
1Vrms at 20
°C
in accordance with specification
4.6.3
insulation resistance
at UR (DC) for 1 minute
in accordance with specification
4.6.4
voltage proof
2.5
× UR for 1 minute
no breakdown or flashover
4.7.2
temperature
coefficient
between minimum and
maximum temperature
in accordance with specification
4.8
adhesion
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
4.9
bond strength of
plating on end face
mounted in accordance with
CECC 32 100, paragraph 4.4
no visible damage
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
C/C: ≤10%
4.10
Tb
resistance to
soldering heat
260
±5 °C for 10 ±0.5 s
in a static solder bath
the terminations shall be well
tinned after recovery
C/C: > 5% and ≤ +10%
whichever is greater
resistance to
leaching
260
±5 °C for 30 ±1s
in a static solder bath
using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%
4.11
Ta
solderability
zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2
±0.5 s
in a solder bath at 235
±5 °C
the terminations shall be well
tinned
≥95%
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