参数资料
| 型号： | 102000F00000G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 106/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL GREASE |
| MSDS 材料安全数据表： | Sil-Free Grease Series MSDS |
| 标准包装： | 1 |
| 系列： | Therolink 1000 |
| 类型： | 润滑脂 |
| 尺寸/尺寸： | 5 oz. 管装 |
| 其它名称： | 000011 |
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9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 10-2000P | 制造商:AIM Cambridge Connectivity Solutions 功能描述: |
| 102001 | 制造商:Weidmuller 功能描述:Conn Feed-Thru 2 POS Screw ST 25A |
| 102001 WDU2.5 BLACK | 制造商:Weidmuller 功能描述:TERMINAL BLOCK DIN 24A BLACK 制造商:Weidmuller 功能描述:TERMINAL BLOCK, DIN, 24A, BLACK 制造商:Weidmuller 功能描述:TERMINAL BLOCK, DIN RAIL, 2POS, BLACK; Connector Type:DIN Terminal Block; Series:W; Connector Mounting:DIN Rail; No. of Contacts:2; Wire Size AWG Min:30AWG; Wire Size AWG Max:12AWG; Approvals / Standards:(Not Available) ;RoHS Compliant: Yes 制造商:Weidmuller 功能描述:TERMINAL BLOCK, DIN RAIL, 2POS, BLACK; Connector Type:DIN Terminal Block; Series:W; Connector Mounting:DIN Rail; Approvals / Standards:(Not Available); No. of Contacts:2; Wire Size AWG Min:30AWG; Wire Size AWG Max:12AWG ;RoHS Compliant: Yes |
| 102001 WDU2.5 BLACK | 制造商:Weidmuller 功能描述:TERMINAL DIN BLACK 26A |
| 1020010000 | 功能描述:WDU 2.5 SERIES FTT/ TER BL BLACK RoHS:是 类别:连接器，互连式 >> 接线座 - Din 轨道，通道 系列:W 标准包装:10 系列:W 类型:馈通式 断开类型:- 位置数:4 级别数目:2 端子 - 宽度:5.1mm 端接类型:螺钉 电流 - IEC:24A 电压 - IEC:400V 电流 - UL:20A 电压 - UL:300V 线规或范围 - AWG:12-30 AWG 线规或范围 - mm²:0.5-4mm² 特点:包括端接块标记 颜色:浅褐 保险丝类型:- 材料 - 绝缘体:热塑塑胶，Wemid 材料可燃性额定值:UL94 V-0 剥线长度:10mm 其它名称:WDK2.5/10 |
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