参数资料
型号: LPC3230FET296,551
厂商: NXP Semiconductors
文件页数: 50/57页
文件大小: 0K
描述: IC ARM9 MCU 256K 296-TFBGA
特色产品: LPC32x0 ARM926EJ-S Processor
标准包装: 126
系列: LPC3200
核心处理器: ARM9
芯体尺寸: 16/32-位
速度: 266MHz
连通性: EBI/EMI,I²C,IrDA,Microwire,SPI,SSI,SSP,UART/USART,USB OTG
外围设备: DMA,I²S,LCD,电机控制 PWM,PWM,WDT
输入/输出数: 51
程序存储器类型: ROMless
RAM 容量: 256K x 8
电压 - 电源 (Vcc/Vdd): 0.9 V ~ 3.6 V
数据转换器: A/D 3x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 296-TFBGA
包装: 托盘
其它名称: 568-4531
935287119551
LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
54 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
10.4 Power consumption in Run mode
Power consumption is shown in Figure 5 for WinCE applications running under typical
conditions from SDRAM. MMU and I-cache/D-cache are enabled. The VFP is turned on
but not used. I2S-interface (channel 1), LCD, SLC NAND controller, I2C1-bus, SD card,
touchscreen ADC, and UART 3 are turned on. All other peripherals are turned off.
The AHB clock HCLK is identical to the core clock for frequencies up to 133 MHz, which is
the maximum allowed HCLK frequency. For higher core frequencies, the HCLK PLL
output must be divided by 2 to obtain an HCLK frequency lower than or equal to 133 MHz
resulting in correspondingly lower power consumption by the AHB peripherals.
Conditions: Tamb =25 C; VDD_CORE = 1.2 V for core frequencies 208 MHz;
VDD_CORE = 1.35 V for core frequencies > 208 MHz; VDD(IO) = 1.8 V.
(1) WinCE running from SDRAM; playing wmv file at 20 frames/s, 32 kHz mono.
(2) WinCE running from SDRAM; playing mp3 file at 128 kbit/s, stereo.
(3) WinCE running from SDRAM; no application running.
Fig 5.
Core current versus core frequency for WinCE applications
core frequency (MHz)
40
280
200
120
002aae762
80
40
120
160
IDD(run)
(mA)
0
(1)
(2)
(3)
HCLK = 133 MHz
HCLK = 72 MHz
VDD_CORE =
1.2 V
VDD_CORE =
1.35 V
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